Redfire75369’s avatarRedfire75369’s Twitter Archive—№ 3,384

  1. Process Node Table/Graph Update: The major differences are regarding Intel 4, TSMC N6/N5, Samsung 4LPE and derivatives therein. There's a lot of other changes, but you'll have to compare them manually for that.
    oh my god twitter doesn’t include alt text from images in their APIoh my god twitter doesn’t include alt text from images in their API
    1. …in reply to @Redfire75369
      Here's tables of each node's revisions, library densities, where possible, and SRAM bitcell sizes. The node names are a complete mess, but it's the only way I could account for 14nm++ and N3E decreasing in density, as well as 12FFC, N6, 6LPP, 3GAP, etc. increasing in density.
      oh my god twitter doesn’t include alt text from images in their APIoh my god twitter doesn’t include alt text from images in their APIoh my god twitter doesn’t include alt text from images in their API
      1. …in reply to @Redfire75369
        Fun Facts: For every 2x shrink in node name, there's ~1.7x shrink in density. TSMC states +6% density on N4P, but also -6% area on N4, meaning a naive calculation says N4 is denser. Samsung added UHD SRAM with 5LPP and continued it on 4LPE, but has yet to reveal its size.
        1. …in reply to @Redfire75369
          Bonuses for anyone that follows me: Samsung 3GAP: ~195.2 TSMC N3E: ~215.9 There's also a mistake in N3, it should be ~234.9, not ~233.9.
          1. …in reply to @Redfire75369
            Small Update, I had completely missed out on this, but TSMC disclosed the HP (HCC) SRAM bitcell size on N5, its 0.025 μm², making it the third densest bitcell disclosed to date, after only N5 HD and I4 HD.