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Pretty much standard, based on what we've known so far. Wasn't expecting a 4HPC node, but given 7HPP, not that outlandish. The lack of a 3GA# node in 2023 makes me hopeful they're trying to fix their issues internally. @Samsung/1577153863546986496Permalink On twitter.com
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Mood +1 🙂
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> Through continuous innovation, its 3D packaging X-Cube with micro-bump interconnection will be ready for mass production in 2024, and bump-less X-Cube will be available in 2026. They continue to be behind on Adv. Packaging versus Intel and TSMC.On twitter.com
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Mood +1 🙂
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Their only real proper customer for I-Cube (interposer) is Baidu, which is kind of sad all things considered. (I still don't really understand the difference between I-Cube and H-Cube)Permalink On twitter.com
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Mood 0