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  1. …in reply to @chiakokhua
    @chiakokhua @Sebasti66855537 Agreed, it's pretty close overall other than HB. In terms of 2.5D, TSMC is better in interposers and Intel is better in LSIs. In terms of μbumps, neither really has a lead. In terms of HB, TSMC is clearly ahead, at least for the time being.
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