Redfire75369’s avatarRedfire75369’s Twitter Archive—№ 3,202

      1. The only slides I cared about, the technology roadmaps. Micron is ramping 1β DRAM and 232L NAND in late 2022. @_fabknowledge_/1524848032621248526
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      DRAM Roadmap 1β uses advanced CMOS techniques and multipatterning. EUV will be introduced with 1γ (Not 1y). R&D into High-NA EUV & 3D DRAM. 1δ and 1ε nodes are in development and pathfinding respectively. 1β will be used for DDR5, LPDDR5 and HBM3.
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    DRAM EUV Introduction Will be introduced in 2024, with 1γ. More Advanced Tools Greater Reliability, Productivity & Performance Mature Enabling Technologies Usage in conjunction with DUV multipatterning.
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      NAND Roadmap Will continue to use advanced CMOS. 2YYL in yield ramping, 3XXL in development and 4XXL in pathfinding. Dual-stack will be used for increasing layer counts. QLC will be used to increase bit shipments per wafer.
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        232L NAND Extended CuA and dual stack process. Increased Density, Power(?) and Bandwidth Will be used with external and internal controllers.
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          Ok, I lied slightly, I did care about three other slides. 1,2: HBM and CXL growth 3: Average Smartphone NAND & DRAM Content 50% of smartphone DRAM and and 60% of smartphone DRAM for FY22 (Q2 2021 - Q1 2022) is quite a good ramp for their 1α and 176L nodes.
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