Redfire75369’s avatarRedfire75369’s Twitter Archive—№ 2,755

  1. GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs eetasia.com/guc-announces-2-5d-and-3d-multi-die-apt-platform-for-ai-hpc-networking-asics/
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    1. …in reply to @Redfire75369
      Notice how N3E is specifically mentioned instead of N3 Other than that, they claim to have a 0.3 pJ/b 2.5D D2D interconnect and 2.5 Tbps/mm shoreline bandwidth density. They also claim a 3D D2D interconnect with 9Tbps/mm².
      oh my god twitter doesn’t include alt text from images in their API
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