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I think I've found the 92x92mm BGA package Intel was claiming, that used 45μm EMIB. Look at the third column. BGA10072 with dimensions of 92.5x92.5mm. Tofino 3 is most likely using EMIB then. intel.com/content/dam/www/central-libraries/us/en/documents/product-brief-final-version-pdf.pdf
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For some reference, they said this during Intel Accelerated. > We are also using that 45 micron pitch EMIB on a 92 x 92 millimeter package, which will be the world's largest ball grid array package.
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