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Re: AWS/Annapurna Graviton3 Despite Intel announcing AWS was a packaging customer for IFS, and Graviton3 using advanced packaging, I don't believe Graviton3 uses EMIB.
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As per @aschilling, the first batch of G3's were manufactured in late July (Probably A0). That means manufacturing started in late April. IFS was announced in late March, and the concept was presented to the Board of Directors in December.
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For G3 to be using EMIB, one of the following would need to be true: 1. ICF offered EMIB, which I'm not aware of 2. AWS got the IP for EMIB in late January or February, before IFS was finalised, and implemented it into their own silicon, as EMIB is lithographically defined.
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Process node might also be a slight issue for point 2, but I'm not 100% sure. I simply don't think there was enough time for AWS/Annapurna to have implemented EMIB into their designs.
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