Redfire75369’s avatarRedfire75369’s Twitter Archive—№ 2,009

  1. Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications news.samsung.com/global/samsung-announces-availability-of-its-leading-edge-2-5d-integration-h-cube-solution-for-high-performance-applications
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      Is the maximum 6 HBM stacks or is it higher? This is unclear. > When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem (...)
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      1. …in reply to @Redfire75369
        We don't have any pitches for this yet. I suspect we'll get those on 17 November. It certainly seems that Samsung is behind Intel in advanced packaging, let alone TSMC.
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