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IEDM seems interesting this year. These are the ones that I think will be very interesting and have picked out. electronicsweekly.com/news/business/67th-iedm-2021-10/
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- 3D at the Device Level, from IBM and Samsung - GaN Meets Moore’s Law, from Intel - Record FeRAM Performance for Embedded Memory, from Intel - A Marriage of Photonics and Terahertz Electronics, Osaka University
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- Beyond the FinFET Era: Challenges and Opportunities for CMOS Technology, IBM - Selective and Atomic-Scale Processes for Advanced Semiconductor Manufacturing, Tokyo Electron - Future Scaling and Integration Technology, IBM Research
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- Processes and Materials Engineering Innovations for Advanced Logic Transistor Scaling, Applied Materials - Interconnect Resistivity: New Materials, Rensselaer Polytechnic Institute - Metrology and Material Characterization for the Era of 3D Logic and Memory, Nova Ltd.
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- Beyond FinFET Devices: GAA, CFET, 2D Material FET, Intel - Heterogenous Integration Using Chiplets & Advanced Packaging, Georgia Tech - Memory-Based AI & Data Analytics Solutions, SK Hynix - RRAM Devices for Data Storage and In-Memory Computing, University of Michigan
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- Practical Implementation of Wireless Power Transfer, IMEC
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As per usual, I'm too poor to actually attend it. I'll just wait for someone else to talk about it.
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