Redfire75369’s avatarRedfire75369’s Twitter Archive—№ 732

  1. RT @VideoCardz: Hot Chips 33: Intel, AMD & TSMC to discuss 3D packaging, Alder Lake architecture overview coming videocardz.com/newz/hot-chips-33-intel-amd-tsmc-to-discuss-3d-packaging-alder-lake-architecture-overview-coming
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